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尊敬的昂科烧录器用户:
您好,十分荣幸和您一起交流学习IC芯片烧录技术与知识分享。现在为您更新AP8000烧录软件临时版本V1_05_99t10(20260312)
下载链接(先注册-登录-再到软件下载中心-下载)https://www.acroview.com/member/login/
昂科自主研发的烧录核心AP8000可支持的芯片种类有Nor Flash/Nand flash、eMMC、UFS、 EEPROM、 EPROM、MCU、CPLD、 CMOS PLD.
包括TSOP, BGA, QFP, TSSOP, FBGA, TQFP, CSP, uBGA, PLCC, SOP, PoP, SSOP, TFBGA,WLCSP等多种封装。
其中烧录器软件适用机型:
烧录器:AP8000、AP8000F、PT100
自动烧录机:IPS5800S、IPS5200S、PH-A2000+、IPS-MINI PRO、PH-A2000、IPS3000S、EAP5000;
更新芯片列表如下:
| V1_05_99t10(20260312) | |||
| IC厂商 | IC型号 | IC封装 | 适配座型号 |
| Analog Devices | ADM1063BCP | QFN40(6x6) | QFN40(6x6)-AG153 |
| ANLOGIC | EF5L150CG484(Bin) | BGA484(19x19) | BGA484(19x19)-AG01 |
| BEKEN | BK1662QN324C | QFN32(4x4) | QFN32(4x4)-AG126 |
| Biwin | BWCMMQ511G08G(UserOnly) | BGA153(11.5x13) | BGA153(11.5x13)-AG01 |
| ConvenientPower | CPS8200 | QFN48(6x6) | QFN48(6x6)-AG48 |
| Giantec | GT25Q32YB-LG | SOP8(150mil) | SO8(150)-AG01 |
| Giantec | GT25Q16YB-LG | SOP8(150mil) | SO8(150)-AG01 |
| HPMicro | HPM6E6Y*GN | BGA196(12x12) | BGA196(12x12)-AG03 |
| HuYang | G27275L2N2100_QFN40(E+P+D) | QFN40(5x5) | QFN40(5x5)-AG173 |
| HuYang | HY061-4076-0016 | BGA153(11.5x13) | BGA153(11.5x13)-AG01 |
| I-Core | RD8F04AS140A-B | SO28(300) | SO28(300)-AG67 |
| I-Core | RD8F06AS140A | SO28(300) | SO28(300)-AG67 |
| I-Core | RD8F04AS140A-B | SO28(300) | SO28(300)-AG67 |
| I-Core | RD8F06AS140A | SO28(300) | SO28(300)-AG67 |
| Infineon | SAK-TC4D9XP-20MF500MC | BGA436(21.3x21.3) | BGA436(21.3x21.3)-4-AG02 |
| Infineon | XDPE1A2G7B(Patch) | QFN56(7x7) | QFN56(7x7)-AG05 |
| iTE | IT6569FN | QFN76(9x9) | QFN76(9x9)-AG04 |
| Lattice | LCMXO2-4000HC-*MG132 | BGA132(8x8) | BGA132(8x8)-AG01 |
| Lattice | LFMXO5-25-*BBG256C | BGA256(14x14) | BGA256(14x14)-AG09 |
| Lattice | LCMXO3LF-9400C(ISP-JTAG-3.3VTTL-3.3V) | NULL | ISP(DAP)-AG01 |
| Lattice | LCMXO3LF-2100C-xBG324 | caBGA324(15x15) | BGA324(15x15)-S02 |
| Linko | LKS32MC037EM6S* | SSOP24(8.65x3.9) | SSOP24(8.65x3.9)-AG27 |
| Linko | LKS32MC037LM6S*C | SSOP24(8.65x3.9) | SSOP24(8.65x3.9)-AG26 |
| Linko | LKS32MC087M6S8 | SSOP24(8.65x3.9) | SSOP24(8.65x3.9)-AG25 |
| Macronix | MX25R6435FBD | WLCSP22(1.99x3.50) | WLCSP22(1.99x3.50)-AG01 |
| Macronix | MX25R6435FBF | WLCSP22(1.99x3.50) | WLCSP22(1.99x3.50)-AG01 |
| Macronix | MX25L25645GXD | 24-Ball BGA (5x5 ball array) | TBGA24(8x6)-AG01 |
| Macronix | MX25V5126FM1 | SOP8(150mil) | SO8(150)-AG01 |
| Macronix | MX25L512EM | SOP8(150mil) | SO8(150)-AG01 |
| Macronix | MX25U51294GXD | 24-Ball BGA (5x5 ball array) | TBGA24(8x6)-AG01 |
| Macronix | MX25U51294GXD(20M) | 24-Ball BGA (5x5 ball array) | TBGA24(8x6)-AG01 |
| Microchip | PIC16LF19176-*/MV | QFN40(5x5) | QFN40(5x5)-AG66 |
| Microchip | PIC16F18854-*/MV | QFN28(4x4) | QFN28(4x4)-AG15 |
| MindMotion | MM32SPIN0280D6P | TQFP48(7x7) | TQFP48(7x7)-AG316 |
| MPS | MPX2100GYT(ISP-HighTemp-TEST045) | ISP-HT-LoadBoard-TSOICW16-15-AG01 | ISP-HighTemp-JPBoard |
| MPS | MP2825FGQKT(ISP-HighTemp-TEST045) | ISP-HT-LoadBoard-QFN52(6x6)-AG02(CS) | ISP-HighTemp-JPBoard |
| MPS | MP2825FGQKT(ISP-HighTemp-TEST045) | ISP-HT-LoadBoard-QFN52(6x6)-AG02(CS) | ISP-HighTemp-JPBoard |
| NewVision | B802-1V | QFN20(3.5x3.5) | QFN20(3.5x3.5)-AG01 |
| Nuvoton | N79E8132AS16 | SO16(150) | SO16(150)-AG49 |
| NXP | MC33FS8530A0ES(ISP-I2C-3.3VTTL-14VEXT) | NULL | ISP-AG28 |
| Realtek | RTS5453S–CG(512K) | QFN52(8x5) | QFN52(8x5)-AG09 |
| Realtek | RTS5439SD-VB-CG(512K) | QFN52(8x5) | QFN52(8x5)-AG09 |
| Realtek | RTS5452A-VB-CG(512K) | QFN52(8x5) | QFN52(8x5)-AG09 |
| Realtek | RTS5453P-CG(512K) | QFN52(8x5) | QFN52(8x5)-AG09 |
| Renesas | RAA228943 | QFN56(7x7) | QFN56(7x7)-AG31 |
| Renesas | RAA229134(Mul-Inc) | QFN48(6x6) | QFN48(6x6)-AG42 |
| RICHTEK | S102-11 | WQFN26(3x3.5) | WQFN26(3x3.5)-AG01 |
| RICHTEK | L102.21 | QFN20(3.5x3.5) | QFN20(3.5x3.5)-AG01 |
| RICHTEK | L102-11 | QFN20(3.5x3.5) | QFN20(3.5x3.5)-AG01 |
| RICHTEK | P105-11 | QFN28(3.5x3.5) | QFN28(3.5x3.5)-AG01 |
| RICHTEK | B802-1R | QFN20(3.5x3.5) | QFN20(3.5x3.5)-AG01 |
| RICHTEK | S102-11 | WQFN26(3x3.5) | WQFN26(3x3.5)-AG01 |
| Silicon Laboratories | SI4010-C2-GS | SOIC14(150) | SO14(150)-AG22 |
| ST | ST25DV04KC-IE*T | TSSOP8 | TSSOP8-AG01 |
| ST | STM32F745IET | PQFP176(24x24) | PQFP176(24x24)-AG04 |
| Swissbit | SFEM010GB2ED1TO-I-5E-11P-STD | BGA153(11.5x13) | BGA153(11.5x13)-AG01 |
| TI | MSPM0G3518*PM | TQFP64(10x10) | TQFP64(10x10)-AG208 |
| TI | TMS5704357BZWT | BGA337(16x16) | BGA337(16x16)-AG05 |
| TI | MSPM0L1305*DGS32 | VSSOP32(8.1x3.0) | VSSOP32(8.1x3.0)-AG01 |
| Winbond | W25Q64JVSSIQ | SO8(210) | SO8(210)-AG01 |
| Winbond | W25Q16JVSNIQ | SO8(150) | SO8(150)-AG01 |
| Winbond | W25Q128JWB*Q | 24-Ball TFBGA 8x6mm(5x5 ball array) | TBGA24(8x6)-AG01 |
| Winbond | W25Q01JVTB*Q | 24-Ball BGA (5x5 ball array) | TBGA24(8x6)-AG01 |
昂科技术简介
昂科技术成立于2013年2月,2016年被认定为国家高新企业和深圳市高新企业,并取得多项软件著作权以及专利,昂科核心人员均拥有编程设备研发、制造以及服务领域十多年的丰富经验,具有世界领先技术,并致力于为客户提供创新的芯片烧录器解决方案和产品。正努力为编程设备的可靠性、安全性以及知识产权保护方面做出杰出贡献。昂科始终坚信对品质与技术的追求会使越来越多的电子厂商选择昂科作为他们值得信赖的合作伙伴,新产品持续在发布中,请保持关注。
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